149 ?2011 littelfuse, inc. specifcations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: april 21, 2011 sp1006 series sp1006 general purpose esd protection - sp1006 series description applications zener diodes fabricated in a proprietary silicon avalanche technology protect each i/o pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (esd). these robust diodes can safely absorb repetitive esd strikes at 30kv (contact discharge, iec 61000-4-2) without performance degradation. additionally, each diode can safely dissipate 5a of 8/20s surge current (iec61000-4-5) with very low clamping voltages. features ? esd, iec61000-4-2, 30kv contact, 30kv air ? eft, iec61000-4-4, 40a (5/50ns) ? lightning, iec61000-4-5, 5a (8/20s) ? low leakage current of 0.5a (max) at 5v ? industries smallest esd footprint available (0201) ? mobile phones ? smart phones ? pdas ? digital cameras ? portable navigation devices ? portable medical devices pinout 1 2 functional block diagram 1 2 life support note: not intended for use in life support or life saving applications the products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. rohs pb green application example i/o controller outside worl d p1 case gnd keypad s p2 ic p3 p4 sp1006 (x4) sp1006 series
?2011 littelfuse, inc. specifcations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 150 tvs diode arrays (spa ? family of products) revision: april 21, 2011 sp1006 series general purpose esd protection - sp1006 series caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specifcation is not implied. absolute maximum ratings symbol parameter value units i pp peak pulse current (t p =8/20s) 5 a t op operating temperature -40 to 85 c t stor storage temperature -60 to 150 c thermal information parameter rating units storage temperature range -65 to 150 c maximum junction temperature 150 c maximum lead temperature (soldering 10s) 260 c electrical characteristics (t op =25 o c) parameter symbol test conditions min typ max units reverse standoff voltage v rwm 6.0 v reverse voltage drop v r i r =1ma (pin 1 to 2) 7. 8 v forward voltage drop v f i r =1ma (pin 2 to 1) 0.8 v leakage current i leak v r =5v 0.1 0.5 a clamp voltage 1 v c i pp =1a, t p =8/20s (pin 1 to 2) 8.3 v i pp =2a, t p =8/20s (pin 1 to 2) 9.2 v dynamic resistance r dyn (v c2 - v c1 ) / (i pp2 - i pp1 ) 0.9 esd withstand voltage 1 v esd iec61000-4-2 (contact discharge) 30 kv iec61000-4-2 (air discharge) 30 kv diode capacitance 1 c d reverse bias=0v 25 pf reverse bias=2.5v 15 pf note: 1 parameter is guaranteed by design and/or device characterization. pulse waveform capacitance vs. reverse bias 0 5 10 15 20 25 30 0. 00 .5 1. 01 .5 2. 02 .5 3. 03 .5 4. 04 .5 5. 0 bi as vo lt age (v ) ca paci ta n ce ( pf) 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 time (s) percent of i pp
151 ?2011 littelfuse, inc. specifcations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: april 21, 2011 sp1006 series sp1006 general purpose esd protection - sp1006 series clamping voltage vs. i pp peak pulse current-i pp (a) clamp voltage (v c ) 0. 0 2. 0 4. 0 6. 0 8. 0 10.0 12.0 14.0 16.0 1. 01 .5 2. 02 .5 3. 03 .5 4. 0 ti me te mperature t p t l t s(max) t s(min) 25 t p t l t s time to peak temperature preheat p rehea t ramp-up r amp-up ramp-down r amp-d o critical zone t l to t p c ritical zo n e t l to t p refow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max refow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 250 +0/-5 c time within 5c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters package dimensions udfn-2 symbol udfn-2 millimeters inches min max min max a 0.34 0.40 0.014 0.016 a1 0.00 0.05 0.000 0.002 a2 0.075 ref 0.003 ref b 0.20 ref 0.008 ref d 0.55 0.65 0.022 0.026 e 0.25 0.35 0.010 0.014 l 0.175 0.275 0.007 0.011 k1 0.15 ref 0.006 ref d e l 2 b k1 bo tt om view t op view side view 0.1 0 0.05 c a b c a c 0.1 0 a1 a2 0.08 c sea ting plane 1 2x 2x 0.1 0 0.1 0 c c
?2011 littelfuse, inc. specifcations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 152 tvs diode arrays (spa ? family of products) revision: april 21, 2011 sp1006 series general purpose esd protection - sp1006 series embossed carrier tape & reel specifcation udfn-2 symbol millimetres inches min max min max a0 0.36 0.42 0.014 0.017 b0 0.66 0.72 0.026 0.028 d0 1.40 1.60 0.055 0.063 e 1.65 1.85 0.065 0.073 f 3.45 3.55 0.136 0.140 k0 0.39 0.45 0.015 0.018 p0 1.95 2.05 0.077 0.081 p1 1.95 2.05 0.077 0.081 p2 3.90 4.10 0.154 0.161 t 0.18 0.22 0.007 0.009 w 7.90 8.30 0.311 0.327 0o max 0o max k0 b0 t a0 w p0 p2 p1 d0 e f 0.20 0.05 ordering information part number package marking min. order qty. SP1006-01UTG udfn-2 - 10000 product characteristics lead plating pre-plated frame lead material copper alloy lead coplanarity 0.0004 inches (0.102mm) subsitute material silicon body material molded epoxy flammability ul94-v-0 notes : 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold fash & metal burr. 4. all specifcations comply to jedec spec mo-223 issue a 5. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. package surface matte fnish vdi 11-13. part numbering system part marking system u: udfn-2 sp 1006 01 u t g series package t= tape & reel g= green number of channels ? silicon protection array (spa tm ) family of tvs diode arrays pin 1 pin 2 stripe
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